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News

EE Times Asia
eetasia.com > trendforce-top-10-global-fabless-ic-design-firms-post-73-yoy-revenue-growth-in-2q-2026

TrendForce: Top 10 Global Fabless IC Design Firms Post 73% YoY Revenue Growth in 2Q 2026

1+ day, 5+ hour ago   (462+ words) Home » IC Design » TrendForce: Top 10 Global Fabless IC Design Firms Post 73% YoY Revenue Growth in 2Q 2026 Combined revenue of the world’s top 10 fabless IC design companies surged by 73% YoY to more than $141.45 billion in 2Q 2026. NVIDIA remained firmly in first place, while…...

EE Times Asia
eetasia.com > alif-semiconductor-launches-low-cost-startkits-for-edge-ai-mcus

Alif Semiconductor Launches Low-cost StartKits for Edge AI MCUs

1+ day, 5+ hour ago   (260+ words) Home » Embedded Systems » Alif Semiconductor Launches Low-cost StartKits for Edge AI MCUs Alif Semiconductor has introduced a new family of low-cost evaluation boards for its Edge AI-enabled Ensemble and Balletto microcontrollers, aimed at lowering the barrier to developing low-power, on-device…...

EE Times Asia
eetasia.com > analog-devices-strengthening-edge-ai-capabilities-by-acquiring-alif-semiconductor

Analog Devices Strengthening Edge AI Capabilities by Acquiring Alif Semiconductor

4+ day, 14+ hour ago   (264+ words) Home » Semiconductor » Analog Devices Strengthening Edge AI Capabilities by Acquiring Alif Semiconductor Analog Devices Inc. (ADI) has agreed to acquire Alif Semiconductor in an all-cash transaction valued at $1.35 billion, adding AI-native processing capabilities to its portfolio of sensing, signal processing,…...

EE Times Asia
eetasia.com > synopsys-astar-ime-target-simulation-led-advanced-packaging-development

Synopsys, A*STAR IME Target Simulation-led Advanced Packaging Development

4+ day, 15+ hour ago   (229+ words) Advanced packaging is becoming a central part of semiconductor system design as AI and high-performance computing drive demand for chiplet-based and heterogeneous architectures. As package complexity increases, however, designers face a growing range of mechanical, thermal and reliability issues that…...

EE Times Asia
eetasia.com > edgecortix-kawasaki-team-up-on-ai-computing-for-future-aerial-defense-systems

EdgeCortix, Kawasaki Team Up on AI Computing for Future Aerial Defense Systems

6+ day, 3+ hour ago   (290+ words) Home » Military » EdgeCortix, Kawasaki Team Up on AI Computing for Future Aerial Defense Systems The program, running from 2026 through 2028, has an initial aggregate value of several million U.S. dollars. The companies will work on technology development, feasibility studies, system integration…...

EE Times Asia
eetasia.com > silicon-motion-targets-agentic-ai-storage-with-montitan-ssd-reference-design-kit

Silicon Motion Targets Agentic AI Storage with MonTitan SSD Reference Design Kit

1+ week, 15+ hour ago   (205+ words) Home » Embedded Systems » Silicon Motion Targets Agentic AI Storage with MonTitan SSD Reference Design Kit Silicon Motion's MonTitan SSD RDK targets predictable QoS and persistent storage for demanding Agentic AI workloads. Silicon Motion Technology’s MonTitan SSD Reference Design Kit (RDK)…...

EE Times Asia
eetasia.com > semi-silicon-catalyst-ink-partnership-to-accelerate-global-semiconductor-innovation

SEMI, Silicon Catalyst Ink Partnership to Accelerate Global Semiconductor Innovation

1+ week, 4+ day ago   (186+ words) Home » Semiconductor » SEMI, Silicon Catalyst Ink Partnership to Accelerate Global Semiconductor Innovation SEMI and Silicon Catalyst have signed a strategic partnership agreement aimed at accelerating innovation and strengthening connections between semiconductor hardware startups, investors, manufacturers, and technology leaders worldwide. The…...

EE Times Asia
eetasia.com > embeddedblog-deepx-bets-on-open-ecosystems-to-take-edge-ai-from-silicon-to-physical-infrastructure

DEEPX Bets on Open Ecosystems to Take Edge AI from Silicon to Physical Infrastructure

1+ week, 4+ day ago   (1563+ words) Home » AI » DEEPX Bets on Open Ecosystems to Take Edge AI from Silicon to Physical Infrastructure DEEPX sees open software, portable models and ultra-low-power inference as critical to scaling physical AI beyond centralized data centers. The next competitive battle in…...

EE Times Asia
eetasia.com > embeddednews-sirin-software-joins-infineon-partner-ecosystem-to-expand-embedded-engineering-support

Sirin Software Joins Infineon Partner Ecosystem to Expand Embedded Engineering Support

1+ week, 4+ day ago   (217+ words) Home » Embedded Systems » Sirin Software Joins Infineon Partner Ecosystem to Expand Embedded Engineering Support Sirin Software has joined the Infineon Technologies partner ecosystem as an INFINEON Associated Partner, expanding its engineering support for connected, secure and AI-enabled embedded products. The…...

EE Times Asia
eetasia.com > ks-targets-ai-networking-growth-with-thermo-compression-bonding-for-cpo

K&S Targets AI Networking Growth with Thermo-Compression Bonding for CPO

1+ week, 4+ day ago   (197+ words) Home » Packaging » K&S Targets AI Networking Growth with Thermo-Compression Bonding for CPO Kulicke & Soffa Industries (K&S) is positioning its advanced packaging portfolio to support the growing adoption of co-packaged optics (CPO) in AI infrastructure, with its thermo-compression bonding (TCB)…...