4+ day, 9+ hour ago   (139+ words) semiengineering.com But in recent years, the conversation has started to change. Today, companies and countries alike are asking different questions. What happens when efficiency conflicts with resilience? What happens when supply chains become strategic? And what happens when interdependency…...

5+ day, 10+ hour ago   (304+ words) Compute vs. energy scaling; adapting to AI; fab digital twin; mobile VLM. Synopsys’ Greg Sorber listens in as industry experts discuss the mismatch between the rapid growth of AI compute and the much slower scaling of the energy systems that power…...

5+ day, 9+ hour ago   (1623+ words) Google, Amazon, and now OpenAI have competitive offerings and are gaining share. GPUs are 70% of installed worldwide AI compute capacity by manufacturer (see figure 1), with custom silicon accounting for 30%, primarily Google and Amazon. Fig. 1: Current installed worldwide AI compute capacity…...

1+ week, 4+ day ago   (612+ words) Security and safety are inseparable in physical systems. By Dana Neustadter and Ilya Tolchinsky Artificial intelligence is moving beyond digital experiences and into systems that interact directly with the physical world. This emerging category of physical AI spans autonomous vehicles…...

1+ week, 4+ day ago   (974+ words) Modern electronic systems are expected to deliver more performance, more connectivity, and greater efficiency than ever before. Interfaces such as DDR, PCIe, Ethernet, and other high-speed SerDes technologies continue to increase data rates while simultaneously reducing available design margins. At…...

1+ week, 4+ day ago   (553+ words) Robots and autonomous vehicles are both edge devices, but a humanoid has wheels as well as fingers. Close interaction with humans raises the stakes. The market for robots and humanoids is growing rapidly for industrial applications, but it’s poised for…...

1+ week, 5+ day ago   (292+ words) Shifting landscape of chip design; AI for 3D-IC; India boosts semiconductors; 6G roadmap. In a podcast, Siemens’ Tova Levy chats with Sudarshan Deo about what AI can do in 3D-IC design today, such as narrowing design space exploration in chiplet partitioning…...

1+ week, 5+ day ago   (96+ words) A complete path from AI model, to trusted silicon, to deployable system. Physical AI demands more than traditional edge silicon. Devices must perceive, reason, and act in real time while protecting data and scaling across product lines. This eBook shows…...

1+ week, 6+ day ago   (815+ words) Part I – Pioneering work in developing CFET-critical modules: an improved backside contact module and a novel gate stack for threshold voltage tuning. By Cassie Sheng, Hiroaki Arimura, and Naoto Horiguchi The semiconductor industry is going through a major architectural transition,…...

2+ week, 2+ min ago   (298+ words) Researchers at Huawei, ETH Zürich, and HUST published a technical paper titled “FLINT: Efficiently Leveraging High Bandwidth Flash for Capacity-Scalable LLM Inference Acceleration.” Abstract: “LLM inference is increasingly constrained by accelerator memory capacity rather than compute throughput. This constraint is…...