3+ day, 12+ hour ago   (1695+ words) Kilowatt-class AI accelerators are forcing engineers to rethink what counts as adequate coverage across workload, thermal behavior, test hardware, and time. On a spec sheet, 1kW of maximum power looks like a single operating condition. In practice, two workloads can hold…...

3+ day, 12+ hour ago   (278+ words) Semiconductor manufacturing generates enormous volumes of data, yet only a fraction of it is analyzed. To quote a recent article from an industry analyst: “Beneath this growth lies a structural shift. Manufacturing complexity is rising faster than the industry’s ability…...

4+ day, 12+ hour ago   (304+ words) Compute vs. energy scaling; adapting to AI; fab digital twin; mobile VLM. Synopsys’ Greg Sorber listens in as industry experts discuss the mismatch between the rapid growth of AI compute and the much slower scaling of the energy systems that power…...

5+ day, 12+ hour ago   (109+ words) HBF for LLM inference; M3D SRAM with BEOL pass-gates at 2nm; distributed GPU architectures; hybrid HBM-HBF memory; GaN-on-silicon polarization superjunctions; programmable silicon photonics; Al dopant activation in 4H-SiC. The post Chip Industry Technical Paper Roundup: Sept. 8 appeared first on Semiconductor Engineering. Chip…...

1+ week, 3+ day ago   (320+ words) By Vincent van der Leest and Ajay Kapoor The same principle applies beyond aerospace and government systems: manipulated medical or financial data can affect critical decisions, while altered training data, model parameters, or inference inputs can poison an AI system....

1+ week, 3+ day ago   (974+ words) Modern electronic systems are expected to deliver more performance, more connectivity, and greater efficiency than ever before. Interfaces such as DDR, PCIe, Ethernet, and other high-speed SerDes technologies continue to increase data rates while simultaneously reducing available design margins. At…...

1+ week, 4+ day ago   (292+ words) Shifting landscape of chip design; AI for 3D-IC; India boosts semiconductors; 6G roadmap. In a podcast, Siemens’ Tova Levy chats with Sudarshan Deo about what AI can do in 3D-IC design today, such as narrowing design space exploration in chiplet partitioning…...

1+ week, 4+ day ago   (541+ words) SE: Does the industry have a good understanding of the impact of AI on PQC? SE: How soon? Shouldn’t it have already happened? Petr: Assuming there are people in that stack who can do that. Giles: I completely agree. It…...

1+ week, 5+ day ago   (98+ words) Semiconductor Engineering Chip Industry Technical Paper Roundup: Sep. 1 Wafer-scale optical interconnects for LLM training; Rowhammer-based inference attacks; 3D-IC test cases; liquid cooling for 2.5D/3D packages; wafer-scale 2D semi growth; DL-based parameter extraction for 2D transistors; and chip-placement optimization. New technical papers recently added…...

2+ week, 2+ day ago   (352+ words) Hot Chips AI HW wave; HBM vs HBC; capacity buildout; Infineon’s latest buy; advanced packaging enablers; foundry report; ASIC security threats; IC tariffs; executive changes; Nvidia, Synopsys earnings; dependence on Taiwan; wafer-scale 2D semiconductors. Hot Chips brought a wave of new…...